Hutschienen / DIN-Rail PCs

Fanless DIN-Rail Box PC, Intel Core i5-1335U 4.4GHz CPU, 8GB (Up to 32GB) DDR5 RAM, 256GB NVME SSD, 2xHDMI, 4x2.5GbE LAN, 3xUSB 3.2, 1xUSB 2.0, 4xCOM, 16-bit DIO, 1xM.2 Key-B, 1xM.2 Key-E (Hailo-8 or WiFi), Audio, 9-36VDC-in with 120W Power Adapter

DIN-Rail Embedded System, Intel Core i3-1220P CPU, 8GB DDR4 RAM, HDMI/DP, 3x2.5GbE LAN, 4xCOM, 2xRS232 Opt., 2xUSB 3.2, 4xUSB 2.0, 12-bit GPIO Opt., 1x2.5" Drive Bay, 1xM.2 2280 Key-M, 1xM.2 3052/3042 Key-B, 1xM.2 2230 Key-E, 12-28VDC-in

Fanless DIN-Rail Box-PC, Intel Celeron 6305E CPU, 8GB (Up to 64GB) DDR4 RAM, HDMI, DP++, 4x2.5GbE LAN, 2xUSB 3.2, 2xUSB 2.0, 4xCOM, 12-bit DIO Opt., 1x2.5" Drive Bay, 1xM.2 3042/52/80 Key-B, 1xM.2 2230 Key-A, 1xPCIe x4 Opt., 12-28VDC-in

Fanless DIN-Rail Box-PC, Intel Core i7-1185G7E CPU, 8GB (Up to 64GB) DDR4 RAM, HDMI, DP++, 4x2.5GbE LAN, 2xUSB 3.2, 2xUSB 2.0, 4xCOM, 12-bit DIO Opt., 1x2.5" Drive Bay, 1xM.2 3042/52/80 Key-B, 1xM.2 2230 Key-A, 1xPCIe x4 Opt., 12-28VDC-in

Embedded Automation System, Intel Atom x7433E CPU, 8GB LPDDR5 RAM, 64GB eMMC, HDMI, 3x2.5GbE LAN, 2xUSB 3.2, 1xUSB Type-C DP/PD Alt., 2xRS232/485 (2.5KV isolation), 8-bit DIO, Fieldbus Slot, 1xMiniPCIe, 1xM.2 2242/3052 Key-B (LTE/SATA), 12-24VDC-in

Fanless Fieldbus Box-PC NIFE-106, Intel N97 2.0GHz CPU, 8GB LPDDR5 RAM, 64GB eMMC, 1xHDMI, 3x2.5GbE LAN, 2xUSB 3.2, 1xRS232/485 2.5KV isolation, 12/24VDC-in

DIN-Rail Bedrock RAI300 PC, AMD Ryzen AI 9 HX370 CPU, 15W TDP, Up to 128GB DDR5 RAM, HDMI+USB4 or HDMI/DP/2xMiniDP, Up to 4x2.5GbE LAN, Up to 4xUSB 3.2, 1xMiniUSB, Up to 4xM.2 (3xKey-M NVME/Hailo, 1xKey-B LTE), Up to 12-60VDC-in w/ Power Module

DIN-Rail Bedrock RAI300 PC, AMD Ryzen AI 9 HX370 CPU, 60W TDP, Up to 128GB DDR5 RAM, HDMI+USB4 or HDMI/DP/2xMiniDP, Up to 4x2.5GbE LAN, Up to 4xUSB 3.2, 1xMiniUSB, Up to 4xM.2 (3xKey-M NVME/Hailo, 1xKey-B LTE), Up to 12-60VDC-in w/ Power Module

Fanless Embedded Din-Rail Box PC, Intel 12/13th Gen Core i3/i5/i7 CPU (35W Max), H610E Chipset, Up to 32GB DDR5 RAM, DP/VGA, 1x2.5GbE LAN, 2xGbE LAN, 4xUSB 3.2, 2xUSB 2.0, 2xUSB 2.0 Int., 2xCOM, 1xMiniPCIe, 1xM.2 Key-M, 1xM.2 Key-E, 12-24VDC-In, R1.0

Fanless DIN-Rail AI Box PC, NVIDIA Jetson Orin Nano 6-core SoC, NVIDIA Ampere 1024-core GPU, 8GB LPDDR5 RAM, 256GB NVME SSD, HDMI, 3xGbE LAN, 1xPoE LAN, 3xUSB 3.2, 1xUSB-C, 1xUSB 2.0, 3xCOM, 16-bit DIO, 1xM.2 Key-B, 1xM.2 Key-E, 9-36VDC-in with PSU

Fanless DIN-Rail Box PC, Intel Celeron x6211E 3.0GHz CPU, 8GB LPDDR4x RAM, HDMI, DP, 2x2.5GbE LAN, 2xUSB 3.2 Gen 2, 2xCOM Opt., 1x2.5" Drive Bay, 1xM.2 3042 Key-B, 1xM.2 2230 Key-A, 12-28VDC-in, External Fan Opt.

Fanless DIN-Rail Box PC, Intel Celeron x6413E 3.0GHz CPU, 8GB LPDDR4x RAM, HDMI, DP, 2x2.5GbE LAN, 2xUSB 3.2 Gen 2, 2xCOM Opt., 1x2.5" Drive Bay, 1xM.2 3042 Key-B, 1xM.2 2230 Key-A, 12-28VDC-in, External Fan Opt.

Fanless DIN-Rail Box PC, Intel Celeron x6425E 3.0GHz CPU, 8GB LPDDR4x RAM, HDMI, DP, 2x2.5GbE LAN, 2xUSB 3.2 Gen 2, 2xCOM Opt., 1x2.5" Drive Bay, 1xM.2 3042 Key-B, 1xM.2 2230 Key-A, 12-28VDC-in, External Fan Opt.

Fanless Din-rail Box PC, Intel Atom x7433RE 1.5GHz CPU, Up to 16GB DDR5 RAM, HDMI, 2x2.5GbE LAN, 2xUSB 3.2, 2xUSB 2.0, 4xCOM, 8-bit DIO, 1xFull-Size MiniPCIe, 1xHalf-Size MiniPCIe, 1xM.2 Key-B+M, 9-36VDC-in, Wide Temp. -40..70C (with WT RAM/SSD)

Fanless Din-rail Box PC, Intel Atom x7433RE 1.5GHz CPU, Up to 16GB DDR5 RAM, HDMI, 2x2.5GbE LAN, 2xUSB 3.2, 2xUSB 2.0, 4xCOM, 8-bit DIO, 1xFull-Size MiniPCIe (LTE), 1xHalf-Size MiniPCIe (SATA/WiFi), 1xM.2 Key-B+M, 9-36VDC-in

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, Up to 32GB DDR4 SODIMM RAM, 2xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 1xUSB 3.0, 2xUSB 2.0, 2xM.2 Key-B, 1xNano-SIM, Hailo-8 Accelerator, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 64GB DDR4 SODIMM RAM, HDMI/VGA, 3x2.5GbE LAN, 4xRS232/422/485, 4xUSB 2.0, 1x8-bit DIO, 1xSIM, 1xM.2 Key-B, 1xM.2 Key-M, 1xFull-Size Mini-PCIe, Audio, 9-36VDC-in, -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, 8GB LPDDR4 RAM, 2xHDMI, 2x2.5GbE LAN, 1xRS232/422/485, 2xRS232, 2xUSB 3.0, 4xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xMini-PCIe, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, Up to 32GB DDR4 SODIMM RAM, 2xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 2xUSB 3.0, 3xUSB 2.0, 2xM.2 Key-B, 1xNano-SIM, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, 8GB LPDDR4 RAM, 2xHDMI, 2x2.5GbE LAN, 1xRS232/422/485, 2xRS232, 2xUSB 3.0, 4xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xMini-PCIe with Hailo-8 Accelerator, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 4xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 2xUSB 3.0, 2xUSB 2.0, 1xM.2 Key-B, 1xM.2 Key-M, 9-36VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 4xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 2xUSB 3.0, 2xUSB 2.0, 1xM.2 Key-B, 1xM.2 Key-M, Hailo-8 Accelerator, 9-36VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 1xHDMI, 1xGbE LAN, 3x2.5GbE LAN, 2xRS232/422/485, 3xUSB 3.0, 2xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xM.2 Key-M, Hailo-8 Accelerator, 12VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 1xHDMI, 1xGbE LAN, 3x2.5GbE LAN, 2xRS232/422/485, 3xUSB 3.0, 2xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xM.2 Key-M, Hailo-8 Accelerator, 12VDC-in, -20..60C