Industrielle Mainboards

Mini-ITX Motherboard, Intel 10th Gen Core i9/i7/i5/i3/Xeon CPU, W480E Chipset, 2xDIMM DDR4 ECC RAM, 2xHDMI, 6xGbE LAN, 4xUSB 3.0, 2xUSB 2.0 Headers, 5xCOM Headers, 4xSATA, 1xPCIe x16, 2xM.2 2280 Key-M, 9-36VDC-in Wide Range

Qseven R2.0 Carrier Board EPIC form factor, Fintek F81866D-I Super IO, Dual 24-bit LVDS/DVI, 4xCOM, 1xUART, 1xUSB 2.0, 2xUSB 3.0, 2xGbE LAN, 8-bit DIO, 1xSD slot, 1xM.2 2230 Key-E, 1xM.2 2280 Key-M, 1xSATA, Audio, 10-30VDC-in, Wide Range, -40..85

SM1200 CPU Module w/ CB100 Base Board, MediaTek Genio 1200 SoC, 8GB LPDDR4X RAM, 64GB Storage, LVDS/DP/HDMI, 2xUSB 2.0, 4xUSB 3.1, 2xGbE LAN, MicroSD, WiFi/BT, 1xM.2 Key-M, 1xM.2 Key-B, Audio, 12VDC-in w/ PSU EU, Android OS, -40..85C

Mini-ITX Motherboard, Intel 8th Gen Core i7/i5/i3/Pentium CPU, Q370 Chipset, Up to 32GB DDR4 RAM, LVDS/HDMI/DP/VGA, 2xGbE LAN, 4xUSB 3.1, 2xUSB 2.0, 6xUSB 3.0 Head., 2xCOM, 4xCOM Head., 8-bit DIO, 1xPS/2, 5xSATA, 1xmSATA, 1xPCIe x16, ATX DC-in

SM1200 CPU Module w/ CB100 Base Board, MediaTek Genio 1200 SoC, 8GB LPDDR4X RAM, 64GB Storage, LVDS/DP/HDMI, 2xUSB 2.0, 4xUSB 3.1, 2xGbE LAN, MicroSD, WiFi/BT, 1xM.2 Key-M, 1xM.2 Key-B, Audio, 12VDC-in w/ PSU US, Yocto OS, -40..85C

Mini-ITX Motherboard, Intel 12th Gen Core i9/i7/i5/i3 CPU, H610 Chipset, Up to 32GB DDR5 RAM, HDMI/DP, LVDS/eDP, 2xGbE LAN, 4xUSB 3.2, 6xCOM Headers, 4xUSB 2.0 Headers, GPIO, 1xSATA, 1xM.2 Key-M SATA, 1xM.2 Key-E, 1xMiniPCIe, Audio, 19-24VDC-in

SMARC CPU Module, Intel Atom x5-E3940 CPU, 8GB LPDDR4 RAM, eMMC Opt., HDMI/eDP/DP++, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.0, 4xUART, SDIO, SMBus, 8-bit GPIO, 1xSATA, 4xPCIe x1 Lanes, MIPI-CSI Opt., Audio, 3-5.25VDC-in, -20..85C

Qseven CPU Module, Intel Atom x6413E CPU, 4GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Qseven CPU Module, Intel Atom x6413E CPU, 8GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Base Board for COM Express Type 2 Module, Winbond W83627HG or Fintek F71869 Super IO, LVDS/VGA, 2xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xRJ45, 8-bit DIO, Audio, 4xSATA, 1xUltra-ATA, 1xFDD, 1xCF, 1xExpressCard, 12VDC-in, -40..85C

Qseven Base Board, Single 24-bit LVDS/Dual 24-bit LVDS/VGA/DVI, 4xCOM, 7xUSB 2.0, 2xGbE LAN, 8-bit DIO, 1xMini-Card, 2xSATA, Audio, 10-30VDC-in Wide Range

Qseven CPU Module, Intel Atom x6413E/x6211E CPU, 4/8GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

ETX Base Board, PC/104-Plus, Dual 24-bit LVDS/VGA, 4xCOM, 4xUSB 2.0, 1xKB/MS, 2xLAN, 16-bit DIO, IDE, Compact Flash, Audio, 12/5VDC-in, -40..85C

XTX Base Board for ETX CPU Modules, LVDS/VGA, 4xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xLAN, 16-bit DIO, 3xPCIe x1, 4xPCI, 1xExpressCard, 4xSATA, 1xUltra-ATA, Audio, AT/ATX DC-in

ETX Carrier Board in ATX form factor, Winbond W83977 Super IO, LVDS/VGA, 4xCOM, 5xUSB 2.0, 2xPS/2 for KB/MS, 1xLAN, 16-bit DIO, 4xPCI, 3xISA, 2xUltra-ATA, 1xFDD, 1xCF, Audio, ATX DC-in, -40..85C

Base Board for COM Express Type 2 Module, Winbond W83627HG Super IO, LVDS/VGA, 2xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xRJ45, 8-bit DIO, Audio, 4xSATA, 1xUltra-ATA, 1xFDD, 1xCF, 1xExpressCard, 12VDC-in, -40..85C

Qseven CPU Module, Intel Atom x6211E CPU, 8GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Base Board for COM Express Mini Type 10 Module, Fintek F71869ED IO Chipset, LVDS/Display Port DDI, 2xGbE LAN, 2xCOM, 4xUSB 2.0, 2xUSB 3.0, 1xKB/MS, 1xMini-Card, 1xCFast, 1xSATA, 8-bit DIO, Audio, 12VDC-in, -40..85C

Qseven CPU Module, Intel Atom x6211E CPU, 4GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Base Board for COM Express Type 2 Module, Fintek F71869ED Super IO, LVDS/VGA, 2xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xRJ45, 8-bit DIO, Audio, 4xSATA, 1xUltra-ATA, 1xFDD, 1xCF, 1xExpressCard, 12VDC-in, -40..85C

CPU Board SBC PICMG 1.3 with Intel Core i3/i5/i7 13/12th Gen, LGA1700, Intel H610E, 2xSODIMM DDR5 up to 64 GB, HDMI,mini DP, x2.5G LAN,2xSATA(+2xSATA to backplane),6xUSB (+4xUSB backplane),2xCOM,1xATX 4-pin 12V,1xPCIe x16,1xPCIe x4 to backplane

COM Express Type 6 Module, Intel Core i5-1250PE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME BGA SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.2, GPIO, 2xSATA, 8xPCIe x1 Lanes, 1xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

Qseven CPU Module, Intel Atom E3845 1.91GHz CPU, 2GB DDR3L RAM, 32GB eMMC, Analog RGB/Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 8xUSB 2.0, SDIO, 2xSATA, 3xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Full-Size SBC PICMG 1.3, Intel 14/13/12th Gen Core i3/i5/i7 CPU, LGA1700, Intel Q670E, Up to 64GB DDR5 RAM, HDMI, MiniDP, 2x2.5GbE LAN, 4xSATA (+2xSATA Backplane), 6xUSB (+8xUSB backplane), 2xCOM, 1xATX 4-pin 12VDC-in