Embedded Module und System-On-Module

Qseven CPU Module, Intel Atom x6413E CPU, 8GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Base Board for COM Express Type 2 Module, Winbond W83627HG or Fintek F71869 Super IO, LVDS/VGA, 2xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xRJ45, 8-bit DIO, Audio, 4xSATA, 1xUltra-ATA, 1xFDD, 1xCF, 1xExpressCard, 12VDC-in, -40..85C

Qseven Base Board, Single 24-bit LVDS/Dual 24-bit LVDS/VGA/DVI, 4xCOM, 7xUSB 2.0, 2xGbE LAN, 8-bit DIO, 1xMini-Card, 2xSATA, Audio, 10-30VDC-in Wide Range

Qseven CPU Module, Intel Atom x6413E/x6211E CPU, 4/8GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

ETX Base Board, PC/104-Plus, Dual 24-bit LVDS/VGA, 4xCOM, 4xUSB 2.0, 1xKB/MS, 2xLAN, 16-bit DIO, IDE, Compact Flash, Audio, 12/5VDC-in, -40..85C

XTX Base Board for ETX CPU Modules, LVDS/VGA, 4xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xLAN, 16-bit DIO, 3xPCIe x1, 4xPCI, 1xExpressCard, 4xSATA, 1xUltra-ATA, Audio, AT/ATX DC-in

ETX Carrier Board in ATX form factor, Winbond W83977 Super IO, LVDS/VGA, 4xCOM, 5xUSB 2.0, 2xPS/2 for KB/MS, 1xLAN, 16-bit DIO, 4xPCI, 3xISA, 2xUltra-ATA, 1xFDD, 1xCF, Audio, ATX DC-in, -40..85C

Base Board for COM Express Type 2 Module, Winbond W83627HG Super IO, LVDS/VGA, 2xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xRJ45, 8-bit DIO, Audio, 4xSATA, 1xUltra-ATA, 1xFDD, 1xCF, 1xExpressCard, 12VDC-in, -40..85C

Qseven CPU Module, Intel Atom x6211E CPU, 8GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Base Board for COM Express Mini Type 10 Module, Fintek F71869ED IO Chipset, LVDS/Display Port DDI, 2xGbE LAN, 2xCOM, 4xUSB 2.0, 2xUSB 3.0, 1xKB/MS, 1xMini-Card, 1xCFast, 1xSATA, 8-bit DIO, Audio, 12VDC-in, -40..85C

Qseven CPU Module, Intel Atom x6211E CPU, 4GB LPDDR4 RAM, eMMC Opt., Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 6xUSB 2.0, 2xUSB 3.1, SDIO, 2xSATA, 4xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Base Board for COM Express Type 2 Module, Fintek F71869ED Super IO, LVDS/VGA, 2xCOM, 6xUSB 2.0, 2xPS/2 for KB/MS, 1xRJ45, 8-bit DIO, Audio, 4xSATA, 1xUltra-ATA, 1xFDD, 1xCF, 1xExpressCard, 12VDC-in, -40..85C

COM Express Type 6 Module, Intel Core i5-1250PE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME BGA SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.2, GPIO, 2xSATA, 8xPCIe x1 Lanes, 1xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

Qseven CPU Module, Intel Atom E3845 1.91GHz CPU, 2GB DDR3L RAM, 32GB eMMC, Analog RGB/Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 8xUSB 2.0, SDIO, 2xSATA, 3xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

Qseven CPU Module, Intel Atom E3825 1.33GHz CPU, 4GB DDR3L RAM, 32GB eMMC, Analog RGB/Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 8xUSB 2.0, SDIO, 2xSATA, 3xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

COM Express Type 6 Module, Intel Core i3-1220PE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME BGA SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.2, GPIO, 2xSATA, 8xPCIe x1 Lanes, 1xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

Qseven CPU Module, Intel Atom E3845 1.91GHz CPU, 4GB DDR3L RAM, 32GB eMMC, Analog RGB/Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 8xUSB 2.0, SDIO, 2xSATA, 3xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C

COM Express Type 6 Module, Intel Core i7-1265UE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.0, GPIO, 2xSATA, 8xPCIe x1 Lanes, 2xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

COM Express Type 6 Module, Intel Core i7-12800HE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME BGA SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.2, GPIO, 2xSATA, 8xPCIe x1 Lanes, 1xPCIe x4 Lane, 1xPCIe x8 Lane, Audio, TPM 2.0, -40..85C

COM Express Type 6 Module, Intel Celeron 7305E CPU, 2xDDR5 SO-DIMM Socket, 1xNVME SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.0, GPIO, 2xSATA, 8xPCIe x1 Lanes, 2xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

COM Express Type 6 Module, Intel Core i5-12600HE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME BGA SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.2, GPIO, 2xSATA, 8xPCIe x1 Lanes, 1xPCIe x4 Lane, 1xPCIe x8 Lane, Audio, TPM 2.0, -40..85C

COM Express Type 6 Module, Intel Core i5-1245UE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.0, GPIO, 2xSATA, 8xPCIe x1 Lanes, 2xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

COM Express Type 6 Module, Intel Core i3-1215UE CPU, 2xDDR5 SO-DIMM Socket, 1xNVME SSD Opt., 2xLVDS/3xDDI/VGA, 1x2.5GbE LAN, 2xUART, 8xUSB 2.0, 4xUSB 3.0, GPIO, 2xSATA, 8xPCIe x1 Lanes, 2xPCIe x4 Lane, Audio, TPM 2.0, -40..85C

Qseven CPU Module, Intel Atom E3845 1.91GHz CPU, 4GB DDR3L RAM, Analog RGB/Dual 24-bit LVDS/1xDDI, 1xGbE LAN, 8xUSB 2.0, SDIO, 2xSATA, 3xPCIe x1 Lanes, Audio, 5VDC-in, -40..85C